TSMC to Build Advanced Chip Packaging Capacity in Japan
This move would help reboot Japan's semiconductor industry.
Taiwan Semiconductor Manufacturing Company (TSMC) is building an advanced chip packaging capacity in Japan as part of Japan’s effort to reboot its semiconductor industry.
The chip packaging capacity will be done using Taiwan’s chip-on-wafer-on substrate (COWOS) packaging technology, which will stack chips on top of each other, boosting processing power and reducing power consumption. TSMC, with a net valuation of $710.52 billion, will collaborate with Sony, worth $108.05 billion, and Toyota, worth $316.98 billion, to raise over $20 billion in investment funds to achieve this venture.
Once finalized, this could boost Japan’s footprint in the chip market, with its semiconductor industry market size valued at $42.86 billion and expected to reach $107.63 billion by 2032.
